Aluminum Heat Sink (≥ 100 cm³ / SIP clip compatible)

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Product details

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Description

The Aluminum Heat Sink (≥ 100 cm³ / SIP Clip Compatible) is a efficiency extruded thermal dissipation solution. It is made to handle medium-to-high power semiconductor packages. This heat sink has a volume of 100 cm³ or more. That gives it a thermal mass and a wide surface area. It works well with convection or forced-air cooling. The heat sink has built-in retention grooves. These grooves are made to fit Single In-line Package (SIP) spring clips. This allows for fast, even and screwless mounting of power ICs. The design makes installation simple and secure. It helps keep power components cool, during operation.

Key Features

Substantial Thermal Volume (≥ 100 cm³): This provides an amount of heat capacity and low thermal resistance. It helps to buffer changes in temperature and keeps the junction temperature safe when there is a continuous load.
SIP Spring-Clip Compatibility: This has mechanical slots or lips. These are designed for tool-snap-on clip retention. This makes sure there is clamping pressure across the package bodies. It avoids any stress from screws.
High-Surface-Area Extruded Fins: These have a parallel vertical fin structure. This is designed for chimney-effect air convection. It also works well with high-flow axial fan configurations.
Superior Thermal Conductivity: This is made from grade extruded aluminum alloy (6063-T5 or equivalent). This material is good for spreading heat from the contact face to the tips of the fins.
Corrosion-Resistant Surface: This has an anodized or degreased bare aluminum finish. This improves the ability to radiate heat. Makes the surface more durable, in different environments.

Technical Specifications

Parameter	Specification
Material	Extruded Aluminum Alloy (e.g., AL6063-T5)
Effective Volume	≥ 100 cm³ (100,000 mm³)
Mounting Mechanism	SIP Spring Clip compatible / Through-hole screw mounting
Package Compatibility	Multi-lead SIP packages, Multiwatt (e.g., TDA audio series), TO-220, TO-247
Thermal Resistance ( $\mathbf{R_{\theta}}$ )	~2.5 °C/W – 4.0 °C/W (Natural Convection, dependent on exact fin profile)
Finish Options	Black Anodized (high emissivity) / Raw Machined / Clear Anodized
Board Mounting	Solderable vertical/horizontal mounting pins or chassis standoff threads

Typical Applications

Audio Power Amplifiers: Works with class-AB and high-output class-D audio ICs that come in SIP or Multiwatt packages, such as TDA7294 LM3886 and the TDA2030/2050 series.
Linear & Switching Power Supplies: Helps cool current bridge rectifiers, primary switching transistors and linear voltage regulators.
Motor Drivers & Inverters: Supports management for integrated H-bridge ICs and for stepper and servo driver stages.
Lab Equipment: Used for passive cooling, in programmable DC loads benchmark test fixtures and embedded industrial controllers.